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MMT05B230T3, MMT05B260T3, MMT05B310T3
Preferred Device
Thyristor Surge Protectors
High Voltage Bidirectional TSPD
These Thyristor Surge Protective devices (TSPD) prevent overvoltage damage to sensitive circuits by lightning, induction and power line crossings. They are breakover-triggered crowbar protectors. Turn-off occurs when the surge current falls below the holding current value. Secondary protection applications for electronic telecom equipment at customer premises. * High Surge Current Capability: 50 Amps 10 x 1000 sec Guaranteed at the extended temp range of -20C to 65C * The MMT05B230T3 Series is used to help equipment meet various regulatory requirements including: Bellcore 1089, ITU K.20 & K.21, IEC 950, UL 1459 & 1950 and FCC Part 68. * Bidirectional Protection in a Single Device * Little Change of Voltage Limit with Transient Amplitude or Rate * Freedom from Wearout Mechanisms Present in Non-Semiconductor Devices * Fail-Safe, Shorts When Overstressed, Preventing Continued Unprotected Operation. * Surface Mount Technology (SMT) * Indicates UL Registered -- File #E116110 * Device Marking: Logo, MMT05B230T3: RPBF; MMT05B260T3: RPBG; MMT05B310T3: RPBJ, and Date Code
MAXIMUM RATINGS (TJ = 25C unless otherwise noted)
Rating Off-State Voltage -- Maximum MMT05B230T3 MMT05B260T3 MMT05B310T3 Maximum Pulse Surge Short Circuit Current Non-Repetitive Double Exponential Decay Waveform Notes 1, 2 10 x 1000 sec (-20C to +65C) 8 x 20 sec 10 x 160 sec 10 x 560 sec Maximum Non-Repetitive Rate of Change of On-State Current Double Exponential Waveform, R = 1.0, L = 1.5 H, C = 1.67 F, Ipk = 110A Symbol VDM Value Unit Volts MMT05B310T3 SMB MMT05B260T3 SMB
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BIDIRECTIONAL TSPD ( 50 AMP SURGE 265 thru 365 VOLTS
)
MT1
MT2
SMB (No Polarity) (Essentially JEDEC DO-214AA) CASE 403C
ORDERING INFORMATION
Device MMT05B230T3 Package SMB Shipping 12mm Tape and Reel (2.5K/Reel) 12mm Tape and Reel (2.5K/Reel) 12mm Tape and Reel (2.5K/Reel)
"170 "200 "270 "50 "150 "100 "70 "150
A(pk)
Preferred devices are recommended choices for future use and best overall value.
IPPS1 IPPS2 IPPS3 IPPS4 di/dt
A/s
(c) Semiconductor Components Industries, LLC, 1999
1
February, 2000 - Rev. 3
Publication Order Number: MMT05B230T3/D
MMT05B230T3, MMT05B260T3, MMT05B310T3
THERMAL CHARACTERISTICS
Characteristic Operating Temperature Range Blocking or Conducting State Overload Junction Temperature -- Maximum Conducting State Only Instantaneous Peak Power Dissipation (Ipk = 50A, 10x1000 sec @ 25C) Maximum Lead Temperature for Soldering Purposes 1/8 from Case for 10 Seconds Symbol TJ1 TJ2 PPK TL Max - 40 to + 125 + 175 2000 260 Unit C C W C
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted) Devices are bidirectional. All electrical parameters apply to forward and reverse polarities.
Characteristics Breakover Voltage (Both polarities) (dv/dt = 100 V/s, ISC = 1.0 A, Vdc = 1000 V) MMT05B230T3 MMT05B260T3 MMT05B310T3 MMT05B230T3 MMT05B260T3 MMT05B310T3 Breakover Voltage (Both polarities) (f = 60 Hz, ISC = 1.0 A(rms), VOC = 1000 V(rms), RI = 1.0 k, t = 0.5 cycle, Note 2) (+65C) MMT05B230T3 MMT05B260T3 MMT05B310T3 Breakover Voltage Temperature Coefficient Breakdown Voltage (I(BR) = 1.0 mA) Both polarities MMT05B230T3 MMT05B260T3 MMT05B310T3 Off State Current (VD1 = 50 V) Both polarities Off State Current (VD2 = VDM) Both polarities On-State Voltage (IT = 1.0 A) (PW 300 s, Duty Cycle 2%, Note 2) Breakover Current (f = 60 Hz, VDM = 1000 V(rms), RS = 1.0 k) Both polarities Holding Current (Both polarities) VS = 500 Volts; IT (Initiating Current) = ID1 ID2 VT IBO IH dv/dt CO dV(BO)/dTJ V(BR) -- -- -- -- -- -- -- 175 130 2000 -- -- 190 240 280 -- -- 1.53 230 340 -- -- 22 53 -- -- -- 2.0 5.0 3.0 -- -- -- -- -- 75 A Volts mA mA V/s pF -- -- -- -- -- -- -- 0.08 280 340 400 -- %/C Volts V(BO) MMT05B230T3 MMT05B260T3 MMT05B310T3 -- -- -- -- -- -- 265 320 365 Symbol V(BO) -- -- -- -- -- -- -- -- -- -- -- -- 265 320 365 280 340 400 Volts Min Typ Max Unit Volts
(+65C)
"1.0 Amp
Note 2 (+65C)
Critical Rate of Rise of Off-State Voltage (Linear waveform, VD = Rated VBR, TJ = 25C) Capacitance (f = 1.0 MHz, 50 Vdc, 1.0 V rms Signal) Capacitance (f = 1.0 MHz, 2.0 Vdc, 15 mV rms Signal) (1) Allow cooling before testing second polarity. (2) Measured under pulse conditions to reduce heating.
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MMT05B230T3, MMT05B260T3, MMT05B310T3
Voltage Current Characteristic of TSPD (Bidirectional Device)
+ Current
Symbol
ID1, ID2 VD1, VD2 VBR VBO IBO IH VTM
Parameter
Off State Leakage Current Off State Blocking Voltage Breakdown Voltage Breakover Voltage Breakover Current Holding Current On State Voltage + Voltage VD1 VD2 V(BR) IH ID1 ID2 I(BO) VTM V(BO)
100 I D1, OFF-STATE CURRENT ( A)
VD1 = 50V
340 V BR , BREAKDOWN VOLTAGE (VOLTS) 320 300 280 260 240 220 200 180 160 - 50 -25 0 25 50 TEMPERATURE (C) 75 100 125
MMT05B230T3 MMT05B260T3 MMT05B310T3
10
1
0.1
0.01
0
20
40
60 80 100 TEMPERATURE (C)
120
140
Figure 1. Off-State Current versus Temperature
Figure 2. Breakdown Voltage versus Temperature
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MMT05B230T3, MMT05B260T3, MMT05B310T3
380 V BO , BREAKOVER VOLTAGE (VOLTS) 360 I H , HOLDING CURRENT (mA) 75 100 125 340 320 300 280 260 240 220 200 - 50 - 25 0 25 50 TEMPERATURE (C)
MMT05B230T3 MMT05B260T3 MMT05B310T3
1000 900 800 700 600 500 400 300 200 100 - 50 -25 0 25 50 TEMPERATURE (C) 75 100 125
Figure 3. Breakover Voltage versus Temperature
Figure 4. Holding Current versus Temperature
100 Ipp - PEAK PULSE CURRENT - %Ipp Peak Value tr = rise time to peak value tf = decay time to half value
100
CURRENT (A)
10
50
Half Value
0 0 tr tf TIME (ms)
1 0.001
0.01
0.1 1 TIME (sec)
10
100
Figure 5. Exponential Decay Pulse Waveform
Figure 6. Peak Surge On-State Current versus Surge Current Duration, Sinusoidal Waveform
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MMT05B230T3, MMT05B260T3, MMT05B310T3
TIP
OUTSIDE PLANT
GND
TELECOM EQUIPMENT
RING
PPTC*
TIP
OUTSIDE PLANT
GND
TELECOM EQUIPMENT
RING
PPTC* *Polymeric PTC (positive temperature coefficient) overcurrent protection device
HEAT COIL
TIP
OUTSIDE PLANT
GND
TELECOM EQUIPMENT
RING HEAT COIL
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MMT05B230T3, MMT05B260T3, MMT05B310T3
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.089 2.261
0.108 2.743
0.085 2.159
inches mm
SMB
PACKAGE DIMENSIONS
SMB (No Polarity) (Essentially JEDEC DO-214AA) CASE 403C-01 ISSUE O
S A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
D
B
C
INCHES DIM MIN MAX A 0.160 0.180 B 0.130 0.150 C 0.075 0.095 D 0.077 0.083 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.205 0.220
MILLIMETERS MIN MAX 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 5.21 5.59
K
P
J
H
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MMT05B230T3, MMT05B260T3, MMT05B310T3
Notes
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MMT05B230T3, MMT05B260T3, MMT05B310T3
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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MMT05B230T3/D

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